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The Q150V Plus is optimised for high-vacuum applications, with an ultimate vacuum of 1 x 10-6 mbar. Together with the use of a wide-range Penning/Pirani gauge, this enables the sputtering of oxidising metals with ultra-fine grain sizes, which are suitable for high resolution imaging. The lower background pressure removes oxygen nitrogen and water vapour from the chamber, avoiding chemical reactions during the sputter process, which could otherwise lead to impurities or defects in the coatings. Similarly, lower scattering allows for high purity, amorphous carbon films of high density.
The Q150V Plus offers all the benefits of the Q150T Plus, but with a finer grain size and thinner coating, for ultra-high-resolution applications (above x 200,000 magnification).
These products are for Research Use Only.
Allows multiple users to input and store coating recipes, with a new feature to sort recipes per user according to recent use.
Intelligent system logic automatically detects which insert is in place and displays the appropriate operating settings and controls for that process.
System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.
Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating recipes are already stored but also allows the user to create their own. Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.
Careful evaporation allows precise control of carbon thickness (with or without the optional film thickness monitor). The quality of the resulting carbon films is also enhanced by the eradication of “sparking” that is a common feature of less advanced coaters.
For reproducible high-quality carbon films, we would recommend the use of shaped carbon rods. Rods are higher purity, less susceptible to debris and easier to control. Pulsed and ramped carbon rod recipes are supplied as standard.
Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron microscopy applications because it will heat the sample and can result in damage when the plasma interacts with the sample. The Q150V Plus series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.
The Q150V S Plus and Q150V ES Plus use easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. The Q150V S Plus and Q150V ES Plus are fitted as standard with a chromium (Cr) sputter target. Other targets options include: Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al. Others are available on request.
Aluminium (Al) rapidly forms an oxide layer, which can be difficult to remove, but the ES & S Plus have special recipes for aluminium that reduce the oxide removal time and prevent excessive pre-sputtering of the target.
This allows the user to configure the system as a sputter coater, evaporator or glow discharge system – all in one space saving format. A carbon cord evaporation insert is available as an option. Automatic detection of the head type when changed.
Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.
Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.
Tall chamber option is available for carbon evaporation to avoid sample heating, to improve uniformity for sputtering and to hold taller samples.
The Q150V Plus has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except for the rotary planetary stage).
Some examples:
Other options are available on request.
Instrument case
585 mm W x 521 mm D x 410 mm H
(total height with coating head open: 650 mm)
Weight
32.4 kg (packed: 42 kg)
Packed dimensions
725 mm W x 660 mm D x 680 mm H
Work chamber
Borosilicate glass 150 mm ID x 133 mm H
Display
115.5 mm W x 86.4 mm H (active area), 640 RGB x 480
(display format), capacitive touch colour display
User interface
Full graphical interface with touch screen buttons,
includes features such as a log of the last 1000 coatings
and reminders for when maintenance is due
Sputter target
Disc-style 57 mm Ø. A 0.3 mm thick chromium (Cr) is
fitted as standard. V S and V ES versions only
Specimen stage
50 mm Ø rotation stage with rotation speed of 8-20
rpm. Other stages available on request.
Vacuum
Rotary pump: 5 m3/hr two-stage rotary pump with oil
mist filter. Hydraulically-formed bellows stainless-steel
backing line.
Turbo pump: Internally mounted 67 L/sec N2 air-cooled
Vacuum Measurement: Wide range gauge (10428)
Ultimate vacuum: 1 x 10-6 mbar*
Pump down time: 5×10-6 mbar in 30 mins*
Sputter vacuum range: Between 5 x 10-3 and 1 x 10-1mbar for gold targets
*Typical ultimate vacuum of the pumping system in a clean
instrument after pre-pumping and venting with dry nitrogen gas
Processes
Sputtering: Sputter current 1-150 mA to a
predetermined thickness (with optional FTM) or by the
built-in timer. The maximum sputtering time is 60 minutes
(without breaking vacuum and with automatically built-in
cooling periods)
Evaporation: Carbon evaporation using rods/cord.
Thermal evaporation of metals from filaments or boats.
For cleaning TEM apertures a standard molybdenum boat
(supplied) can be fitted
Visual status indicator
A large multi-colour status indicator light provides a visual
indication of the state of the equipment, allowing users to
easily identify the status of a process at a distance.
The indicator LED shows the following states:
• Initialisation
• Process running
• Idle
• Coating in progress
• Process completed
• Process ended in fault condition
Audio indication also sounds on completion of the process.
