Automatic Stylus Profiler JS2000C

Automatic Stylus Profiler JS2000C

Domestic automatic stylus profiler JS2000C, with high accuracy and high decomposition ability, with a one-piece granite structure, provides stable and reliable repeatability measurement.

JS2000C provides two colour cameras to image the sample and the tip of the needle at the same time, which can observe the sample area without aberration, and it is convenient to locate the feature area. Meanwhile, when scanning with the probe, the scanning area can be observed in real time.

Features

Accurate measurement, rich functionality, all-in-one integration, modular design, convenient after-sales service, and excellent cost performance.

Applications

  • Thickness measurements, such as etching, deposition, and thin films.
  • Measurement of surface parameters such as roughness and warpage of thin films and polysilicon.
  • Various types of thin films and other stress measurements
  • 3D scanning imaging
  • Scheduled task and multi-point scanning
  • Batch testing of wafers, batch processing of data, etc.

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Prices shown are for the United Arab Emirates only and exclude VAT @ 5% Local Rate (Unless Otherwise Stated).
Other countries may incur additional import duties.

Please Contact Us for further details and pricing for your country or location.

Automatic Stylus Profiler JS2000C

Domestic automatic stylus profiler JS2000C, with high accuracy and high decomposition ability, with a one-piece granite structure, provides stable and reliable repeatability measurement.

JS2000C provides two colour cameras to image the sample and the tip of the needle at the same time, which can observe the sample area without aberration, and it is convenient to locate the feature area. Meanwhile, when scanning with the probe, the scanning area can be observed in real time.

Features

Accurate measurement, rich functionality, all-in-one integration, modular design, convenient after-sales service, and excellent cost performance.

Applications
  • Thickness measurements, such as etching, deposition, and thin films.
  • Measurement of surface parameters such as roughness and warpage of thin films and polysilicon.
  • Various types of thin films and other stress measurements
  • 3D scanning imaging
  • Scheduled task and multi-point scanning
  • Batch testing of wafers, batch processing of data, etc.
System Components
  • EFEM (SMIF+ROBOT+ALINGER)
  • JS200C
Options
  • Height calibration sample
  • FFU module
  • EFEM (SMIF+ROBOT+ALINGER)
  • E84 Interface

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